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Co-authors
S. D. BaderArgonne National LaboratoryVerified email at anl.gov
novosad, v.Argonne National LaboratoryVerified email at anl.gov
M. Benjamin JungfleischDepartment of Physics and Astronomy, University of DelawareVerified email at udel.edu
Wei ZhangOakland University, Argonne National LaboratoryVerified email at oakland.edu
Frank FradinArgonne National LaboratoryVerified email at anl.gov
Jiang WanjunDepartment of Physics, Tsinghua UniversityVerified email at tsinghua.edu.cn
Suzanne G.E. te VelthuisArgonne National LaboratoryVerified email at anl.gov
Goran KarapetrovDrexel UniversityVerified email at drexel.edu
Junjia DingHardware Engineer, Verily Life SciencesVerified email at google.com
Joseph SklenarWayne State UniversityVerified email at wayne.edu
Z. Q. QIUProfessor of physics, University of California at BerkeleyVerified email at berkeley.edu
Anand BhattacharyaPhysicist, Argonne National LaboratoryVerified email at anl.gov
John KettersonNorthwestern UniversityVerified email at northwestern.edu
vincent vlaminckMaître de Conférence, IMT-AtlantiqueVerified email at imt-atlantique.fr
Helmut SchultheissHelmholtz-Center Dresden-RossendorfVerified email at hzdr.de
Clarence ChangArgonne National Lab and the University of ChicagoVerified email at kicp.uchicago.edu
Eric FullertonUniversity of California, San DiegoVerified email at ucsd.edu
Shikha JainPrincipal Research Engineer, Western DigitalVerified email at wdc.com
Oleksandr MosendzWDCVerified email at wdc.com
Chun-Yeol YouDepartment of Emerging Materials Science, DGIST, KoreaVerified email at dgist.ac.kr
John Pearson
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