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Yiting Zhang
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Atomic layer etching of 3D structures in silicon: Self-limiting and nonideal reactions
CM Huard, Y Zhang, S Sriraman, A Paterson, KJ Kanarik, MJ Kushner
Journal of Vacuum Science & Technology A: Vacuum, Surfaces and Films 35 (3 …, 2017
832017
Role of neutral transport in aspect ratio dependent plasma etching of three-dimensional features
CM Huard, Y Zhang, S Sriraman, A Paterson, MJ Kushner
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 35 (5 …, 2017
642017
Investigation of feature orientation and consequences of ion tilting during plasma etching with a three-dimensional feature profile simulator
Y Zhang, C Huard, S Sriraman, J Belen, A Paterson, M Kushner
Journal of Vacuum Science & Technology A 35 (2), 021303, 2016
622016
Control of ion energy distributions using phase shifting in multi-frequency capacitively coupled plasmas
Y Zhang, A Zafar, DJ Coumou, SC Shannon, MJ Kushner
Journal of Applied Physics 117 (23), 2015
592015
Control of ion energy and angular distributions in dual-frequency capacitively coupled plasmas through power ratios and phase: Consequences on etch profiles
Y Zhang, MJ Kushner, S Sriraman, A Marakhtanov, J Holland, A Paterson
Journal of Vacuum Science & Technology A 33 (3), 031302, 2015
462015
Atomic layer etching in continuous plasma
Z Tan, Y Zhang, Y Wu, Q Xu, Q Fu, Y Yamaguchi, L Cui
US Patent 9,991,128, 2018
282018
Space and phase resolved ion energy and angular distributions in single-and dual-frequency capacitively coupled plasmas
Y Zhang, MJ Kushner, N Moore, P Pribyl, W Gekelman
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 31 (6 …, 2013
232013
2-dimensional ion velocity distributions measured by laser-induced fluorescence above a radio-frequency biased silicon wafer
NB Moore, W Gekelman, P Pribyl, Y Zhang, MJ Kushner
Physics of Plasmas 20 (8), 2013
72013
Control of on-wafer cd uniformity with movable edge ring and gas injection adjustment
Y Zhang, S Sriraman, A Paterson
US Patent App. US20180053629A1, 2018
2018
Line edge roughness improvement with sidewall sputtering
Z Tan, H Xiang, Y Zhang, Q Fu, Q Xu
US Patent 9,852,924, 2017
2017
Near-Substrate Supplemental Plasma Density Generation with Low Bias Voltage within Inductively Coupled Plasma Processing Chamber
Z Tan, Y Zhang, Q Fu, Q Xu, Y Wu, S Sriraman, A Paterson
US Patent App. US20180204708A1, 2017
2017
Multi-Zone Cooling Of Plasma Heated Window
Y Zhang, R Marsh, S Sriraman, A Paterson
US Patent App. US20190148118A1, 2017
2017
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