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Dr T.D.A. Jones
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Year
A rapid photopatterning method for selective plating of 2D and 3D microcircuitry on polyetherimide
J Marques‐Hueso, TDA Jones, DE Watson, A Ryspayeva, MN Esfahani, ...
Advanced Functional Materials 28 (6), 1704451, 2018
432018
A rapid technique for the direct metallization of PDMS substrates for flexible and stretchable electronics applications
A Ryspayeva, TDA Jones, MN Esfahani, MP Shuttleworth, RA Harris, ...
Microelectronic Engineering 209, 35-40, 2019
282019
Selective electroless copper deposition by using photolithographic polymer/Ag nanocomposite
A Ryspayeva, TDA Jones, MN Esfahani, MP Shuttleworth, RA Harris, ...
IEEE Transactions on Electron Devices 66 (4), 1843-1848, 2019
232019
Copper electroplating of PCB interconnects using megasonic acoustic streaming
TDA Jones, A Bernassau, D Flynn, D Price, M Beadel, MPY Desmulliez
Ultrasonics sonochemistry 42, 434-444, 2018
222018
Selective Metallization of 3D Printable Thermoplastic Polyurethanes
A Ryspayeva, TDA Jones, SR Khan, MN Esfahani, MP Shuttleworth, ...
IEEE Access 7, 104947-104955, 2019
182019
Direct metallisation of polyetherimide substrates by activation with different metals
TDA Jones, A Ryspayeva, MN Esfahani, MP Shuttleworth, RA Harris, ...
Surface and Coatings Technology 360, 285-296, 2019
182019
A highly compact packaging concept for ultrasound transducer arrays embedded in neurosurgical needles
G Schiavone, T Jones, D Price, R McPhillips, Y Jiang, Z Qiu, C Meggs, ...
Microsystem Technologies 23 (9), 3881-3891, 2017
142017
PEI/Ag as an optical gas nano-sensor for intelligent food packaging
A Rvspayeva, TDA Jones, PA Hughes, MN Esfahani, MP Shuttleworth, ...
2018 IEEE 18th International Conference on Nanotechnology (IEEE-NANO), 1-4, 2018
132018
Electroplating for high aspect ratio vias in PCB manufacturing: enhancement capabilities of acoustic streaming
N Strusevich, MPY Desmulliez, E Abraham, D Flynn, T Jones, M Patel, ...
Advances in Manufacturing 1 (3), 211-217, 2013
132013
Analysis of throwing power for megasonic assisted electrodeposition of copper inside THVs
TDA Jones, A Bernassau, D Flynn, D Price, M Beadel, MPY Desmulliez
Ultrasonics, 106111, 2020
102020
Hybrid additive manufacture of conformal antennas
MRN Esfahani, MP Shuttleworth, RA Harris, RW Kay, V Doychinov, ...
2018 IEEE MTT-S International Microwave Workshop Series on Advanced …, 2018
82018
Morphology and acoustic artefacts of copper deposits electroplated using megasonic assisted agitation
TDA Jones, D Flynn, MPY Desmulliez, D Price, M Beadel, N Strusevich, ...
Circuit World, 2016
72016
Spinach-based photo-catalyst for selective plating on polyimide-based substrates for micro-patterning circuitry
J Marques-Hueso, TDA Jones, DE Watson, A Ryspayeva, MN Esfahani, ...
Chemical Engineering Research and Design 153, 839-848, 2020
62020
Advanced electrical array interconnections for ultrasound probes integrated in surgical needles
G Schiavone, T Jones, D Price, R McPhillips, Z Qiu, CEM Demore, ...
2014 IEEE 16th electronics packaging technology conference (EPTC), 88-93, 2014
42014
MACFEST: Benchmarking a new solder-able finish for the PCB industry
T Jones
Journal of the Institute of Circuit Technology 10 (1), 13-19, 2017
22017
Megasound acoustic surface treatment process in the Printed Circuit Board industry
TDA Jones, D Flynn, MPY Desmulliez
2016 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS …, 2016
22016
A new digitally driven process for the fabrication of integrated flex-rigid electronics
MP Shuttleworth, MN Esfahani, J Marques-Hueso, TDA Jones, ...
Proceedings of the 29th Annual International Solid Freeform Fabrication …, 2018
12018
Flexible Electronics: A Rapid Photopatterning Method for Selective Plating of 2D and 3D Microcircuitry on Polyetherimide (Adv. Funct. Mater. 6/2018)
J Marques‐Hueso, TDA Jones, DE Watson, A Ryspayeva, MN Esfahani, ...
Advanced Functional Materials 28 (6), 1870041, 2018
2018
31: Direct metallisation method onto 3-D printed polyetherimide substrates
TDA Jones, MA Ryspayeva, MN Esfahani, R Harris, RW Kay, ...
2018
Enhanced electrodeposition for the filling of micro-vias
TDA Jones
Heriot-Watt University, 2017
2017
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Articles 1–20