W. Rhett Davis
W. Rhett Davis
Professor of Electrical and Computer Engineering, North Carolina State University
Verified email at ncsu.edu
Cited by
Cited by
Demystifying 3D ICs: The pros and cons of going vertical
WR Davis, J Wilson, S Mick, J Xu, H Hua, C Mineo, AM Sule, M Steer, ...
IEEE Design & Test of Computers 22 (6), 498-510, 2005
FreePDK: An open-source variation-aware design kit
JE Stine, I Castellanos, M Wood, J Henson, F Love, WR Davis, ...
2007 IEEE international conference on Microelectronic Systems Education (MSE …, 2007
Design and CAD for 3D integrated circuits
PD Franzon, WR Davis, MB Steer, S Lipa, EC Oh, T Thorolfsson, ...
2008 45th ACM/IEEE Design Automation Conference, 668-673, 2008
A design environment for high-throughput low-power dedicated signal processing systems
WR Davis, N Zhang, K Camera, D Markovic, T Smilkstein, MJ Ammer, ...
IEEE Journal of Solid-State Circuits 37 (3), 420-431, 2002
A 500-Mb/s soft-output Viterbi decoder
E Yeo, SA Augsburger, WR Davis, B Nikolic
IEEE Journal of Solid-State Circuits 38 (7), 1234-1241, 2003
FreePDK15: An open-source predictive process design kit for 15nm FinFET technology
K Bhanushali, WR Davis
Proceedings of the 2015 Symposium on International Symposium on Physical …, 2015
Exploring compromises among timing, power and temperature in three-dimensional integrated circuits
H Hua, C Mineo, K Schoenfliess, A Sule, S Melamed, R Jenkal, WR Davis
Proceedings of the 43rd annual Design Automation Conference, 997-1002, 2006
Rationale for a 3D heterogeneous multi-core processor
E Rotenberg, BH Dwiel, E Forbes, Z Zhang, R Widialaksono, ...
2013 IEEE 31st International Conference on Computer Design (ICCD), 154-168, 2013
Application exploration for 3-D integrated circuits: TCAM, FIFO, and FFT case studies
WR Davis, EC Oh, AM Sule, PD Franzon
IEEE transactions on very large scale integration (VLSI) systems 17 (4), 496-506, 2009
Wireless systems-on-a-chip design
RW Brodersen, WR Davis, D Yee, N Zhang
2001 International Symposium on VLSI Technology, Systems, and Applications …, 2001
Inter-die signaling in three dimensional integrated circuits
C Mineo, R Jenkal, S Melamed, WR Davis
2008 IEEE Custom Integrated Circuits Conference, 655-658, 2008
Junction-level thermal analysis of 3-D integrated circuits using high definition power blurring
S Melamed, T Thorolfsson, TR Harris, S Priyadarshi, P Franzon, MB Steer, ...
IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2012
Creating 3D specific systems: Architecture, design and CAD
PD Franzon, WR Davis, T Thorolffson
2010 Design, Automation & Test in Europe Conference & Exhibition (DATE 2010 …, 2010
Junction-level thermal extraction and simulation of 3DICs
S Melamed, T Thorolfsson, A Srinivasan, E Cheng, P Franzon, R Davis
2009 IEEE International Conference on 3D System Integration, 1-7, 2009
Implementation of high throughput soft output Viterbi decoders
E Yeo, SA Augsburger, WR Davis, B Nikolic
IEEE Workshop on Signal Processing Systems, 146-151, 2002
Leakage power contributor modeling
N Dhanwada, D Hathaway, J Frenkil, WR Davis, H Demircioglu
IEEE Design & Test of Computers 29 (2), 71-78, 2012
A transient electrothermal analysis of three-dimensional integrated circuits
TR Harris, S Priyadarshi, S Melamed, C Ortega, R Manohar, SR Dooley, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology 2 (4 …, 2012
Design for 3D integration and applications
PD Franzon, WR Davis, MB Steer, H Hao, S Lipa, S Luniya, C Mineo, J Oh, ...
2007 International Symposium on Signals, Systems and Electronics, 263-266, 2007
Pathfinder 3D: A flow for system-level design space exploration
S Priyadarshi, J Hu, WH Choi, S Melamed, X Chen, WR Davis, ...
2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE …, 2011
Automated design space exploration for DSP applications
R Hourani, R Jenkal, WR Davis, W Alexander
Journal of Signal Processing Systems 56 (2), 199-216, 2009
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