| Heat transfer fluids for concentrating solar power systems–a review K Vignarooban, X Xu, A Arvay, K Hsu, AM Kannan Applied Energy 146, 383-396, 2015 | 980 | 2015 |
| Additive manufacturing of metals: the technology, materials, design and production L Yang, K Hsu, B Baughman, D Godfrey, F Medina, M Menon, S Wiener Springer, 2017 | 361 | 2017 |
| Nonlithographic patterning and metal-assisted chemical etching for manufacturing of tunable light-emitting silicon nanowire arrays W Chern, K Hsu, IS Chun, BP Azeredo, N Ahmed, KH Kim, J Zuo, N Fang, ... Nano letters 10 (5), 1582-1588, 2010 | 273 | 2010 |
| Prospects and problems of concentrating solar power technologies for power generation in the desert regions X Xu, K Vignarooban, B Xu, K Hsu, AM Kannan Renewable and Sustainable Energy Reviews 53, 1106-1131, 2016 | 265 | 2016 |
| An in-process laser localized pre-deposition heating approach to inter-layer bond strengthening in extrusion based polymer additive manufacturing AK Ravi, A Deshpande, KH Hsu Journal of Manufacturing Processes 24, 179-185, 2016 | 217 | 2016 |
| Porosity control in metal-assisted chemical etching of degenerately doped silicon nanowires K Balasundaram, JS Sadhu, JC Shin, B Azeredo, D Chanda, M Malik, ... Nanotechnology 23 (30), 305304, 2012 | 171 | 2012 |
| Thermal conductivity of silicon nanowire arrays with controlled roughness JP Feser, JS Sadhu, BP Azeredo, KH Hsu, J Ma, J Kim, M Seong, ... Journal of Applied Physics 112 (11), 2012 | 162 | 2012 |
| Imaging of plasmonic modes of silver nanoparticles using high-resolution cathodoluminescence spectroscopy P Chaturvedi, KH Hsu, A Kumar, KH Fung, JC Mabon, NX Fang ACS nano 3 (10), 2965-2974, 2009 | 158 | 2009 |
| Electrochemical nanoimprinting with solid-state superionic stamps KH Hsu, PL Schultz, PM Ferreira, NX Fang Nano Letters 7 (2), 446-451, 2007 | 104 | 2007 |
| Effect of ultrasonic vibration on interlayer adhesion in fused filament fabrication 3D printed ABS A Tofangchi, P Han, J Izquierdo, A Iyengar, K Hsu Polymers 11 (2), 315, 2019 | 96 | 2019 |
| Silicon nanowires with controlled sidewall profile and roughness fabricated by thin-film dewetting and metal-assisted chemical etching BP Azeredo, J Sadhu, J Ma, K Jacobs, J Kim, K Lee, JH Eraker, X Li, ... Nanotechnology 24 (22), 225305, 2013 | 83 | 2013 |
| Spectral phonon scattering from sub-10 nm surface roughness wavelengths in metal-assisted chemically etched Si nanowires MG Ghossoub, KV Valavala, M Seong, B Azeredo, K Hsu, JS Sadhu, ... Nano letters 13 (4), 1564-1571, 2013 | 75 | 2013 |
| Direct imprinting of porous silicon via metal‐assisted chemical etching BP Azeredo, YW Lin, A Avagyan, M Sivaguru, K Hsu, P Ferreira Advanced Functional Materials 26 (17), 2929-2939, 2016 | 74 | 2016 |
| An approach to improve interface healing in FFF-3D printed Ultem 1010 using laser pre-deposition heating P Han, A Tofangchi, A Deshpande, S Zhang, K Hsu Procedia Manufacturing 34, 672-677, 2019 | 67 | 2019 |
| Interlayer thermal history modification for interface strength in fused filament fabricated parts A Deshpande, A Ravi, S Kusel, R Churchwell, K Hsu Progress in Additive Manufacturing 4, 63-70, 2019 | 56 | 2019 |
| Effect of post processing heat treatment routes on microstructure and mechanical property evolution of Haynes 282 Ni-based superalloy fabricated with selective laser melting (SLM) A Deshpande, S Deb Nath, S Atre, K Hsu Metals 10 (5), 629, 2020 | 48 | 2020 |
| Effect of in-process laser interface heating on strength isotropy of extrusion-based additively manufactured PEEK P Han, A Tofangchi, S Zhang, A Desphande, K Hsu Procedia Manufacturing 48, 737-742, 2020 | 36 | 2020 |
| Acoustic energy enabled dynamic recovery in aluminium and its effects on stress evolution and post-deformation microstructure A Deshpande, K Hsu Materials Science and Engineering A 711, 62-63, 2018 | 35 | 2018 |
| Direct metal nano-imprinting using an embossed solid electrolyte stamp A Kumar, KH Hsu, KE Jacobs, PM Ferreira, NX Fang Nanotechnology 22 (15), 155302, 2011 | 35 | 2011 |
| Microstructure evolution of Al6061 and copper during ultrasonic energy assisted compression A Deshpande, A Tofangchi, K Hsu Materials Characterization 153, 240-250, 2019 | 29 | 2019 |
