| The dependence of interspace discharge transitivity upon the gap debris in precision electrodischarge machining YF Luo Journal of materials processing technology 68 (2), 121-131, 1997 | 131 | 1997 |
| Investigation of silicon wafering by wire EDM YF Luo, CG Chen, ZF Tong Journal of materials science 27, 5805-5810, 1992 | 117 | 1992 |
| Rupture failure and mechanical strength of the electrode wire used in wire EDM YF Luo Journal of Materials Processing Technology 94 (2-3), 208-215, 1999 | 85 | 1999 |
| An energy-distribution strategy in fast-cutting wire EDM YF Luo Journal of materials processing technology 55 (3-4), 380-390, 1995 | 54 | 1995 |
| Mirror surface EDM by electric field partially induced YF Luo, ZY Zhang, CY Yu, YZ Zhang CIRP Annals 37 (1), 179-181, 1988 | 30 | 1988 |
| An investigation into the actual EDM off-time in SEA machining YF Luo Journal of materials processing technology 74 (1-3), 61-68, 1998 | 25 | 1998 |
| Effect of a pulsed electromagnetic field on the surface roughness in superfinishing EDM YF Luo, CG Chen Precision engineering 12 (2), 97-100, 1990 | 23 | 1990 |
| Slicing thin silicon wafers by wire EDM cutting YF Luo ISEM 10, 287, 1992 | 15 | 1992 |
| An evaluation of spark mobility in electrical discharge machining YF Luo IEEE transactions on plasma science 26 (3), 1010-1016, 1998 | 14 | 1998 |
| Metal removal in EDM driven by shifting secondary discharge YF Luo, J Tao | 10 | 2009 |
| Differential equations for the ultra-fast transient migration in electrolytic dissolution YF Luo Electrochemistry communications 8 (2), 353-358, 2006 | 9 | 2006 |
| Shifting secondary discharge as the expulsion mechanism in EDM YF Luo, J Tao International Manufacturing Science and Engineering Conference 48517, 205-209, 2008 | 1 | 2008 |
| Mechanical compatibility of deposited films on a hard substrate YF Luo, KP Rajurkar Proceedings of the 1993 ASME Winter Annual Meeting, 93-104, 1993 | 1 | 1993 |
| The burdened area as a structural indicator of interface bonding strength YF Luo | | 1998 |
| A micro-mechanics investigation on the bonding strength of heteroepitaxical film or strip on a hard substrate YF Luo, KP Rajurkar | | 1995 |
| Post-deposition thermal treatments for improving the interconnection strength of a Ti-W/Au/Cu bonding system YF Luo, KP Rajurkar Journal of materials science 29, 5407-5416, 1994 | | 1994 |
