| DEMO design using the SYCOMORE system code: Influence of technological constraints on the reactor performances C Reux, S Kahn, L Zani, B Pégourié, N Piot, M Owsiak, G Aiello, JF Artaud, ... Fusion Engineering and Design 136, 1572-1576, 2018 | 17 | 2018 |
| Development and Applications of Magnet Module for SYCOMORE CEA System Code L Zani, JF Artaud, A Boutry, L Di Gallo, JL Duchateau, P Hertout, S Kahn, ... IEEE Transactions on Plasma Science 46 (8), 3109-3114, 2018 | 7 | 2018 |
| Figures-of-Merit and current metric for the comparison of IGCTs and IGBTs in Modular Multilevel Converters A Boutry, C Buttay, D Dong, R Burgos, B Lefebvre, F Morel, C Davidson 2020 22nd European Conference on Power Electronics and Applications (EPE'20 …, 2020 | 5 | 2020 |
| Experimental study of the reduction and removal of turn-on snubber for IGCT based MMC submodule using fast silicon diodes A Boutry, C Buttay, B Asllani, B Lefebvre, E Vagnon, D Dong 2022 24th European Conference on Power Electronics and Applications (EPE'22 …, 2022 | 3 | 2022 |
| Theoretical and experimental evaluation of the Integrated gate-commutated thyristor (IGCT) as a switch for Modular Multi Level Converters (MMC) A Boutry Université de Lyon, 2021 | 2 | 2021 |
| Novel Figures of Merit for Evaluating the Performance of the Super-Cascode Switch S Jimenez, A Lemmon, A Boutry IEEE Open Journal of Power Electronics, 2023 | 1 | 2023 |
| DEMO design using the SYCOMORE system code: conservative assumptions and pathways towards the reactor C Reux, JF Artaud, G Aiello, A Boutry, J Bucalossi, G Ciraolo, S Dardour, ... Proceedings of the 26th IAEA FEC Conference, Kyoto, Japan, 2016 | 1 | 2016 |
| Design and Evaluation of a 6.5 kV, 400 A Super-Cascode Power Module S Jimenez, A Lemmon, A Boutry IEEE Open Journal of Power Electronics, 2024 | | 2024 |
| Improved non-destructive mutual inductance estimation method for multi-chip power modules A Boutry, S Jimenez, A Lemmon 2023 IEEE 10th Workshop on Wide Bandgap Power Devices & Applications (WiPDA …, 2023 | | 2023 |
| Design of a test package for high voltage SiC diodes A Boutry, C Buttay, B Lefebvre, E Vagnon, D Planson, LV Phung Proceedings of the International Workshop on Integrated Power Packaging …, 2022 | | 2022 |
Davide GalassiÉcole Polytechnique Fédérale de LausanneVerified email at epfl.ch
