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Min Sup ChoiDepartment of Materials Science and Engineering, Chungnam National UniversityVerified email at cnu.ac.kr
Daeyeong LeeSamsumg ElectronicsVerified email at samsung.com
James C. HoneDepartment of Mechanical Engineering, Columbia UniversityVerified email at columbia.edu
Xiaochi Liu 刘晓迟School of Physics, Central South UniversityVerified email at csu.edu.cn
Deshun QuPh.D, SAINT, Sungkyunkwan UniversityVerified email at skku.edu
Inyong MoonSungkyunkwan UniversityVerified email at skku.edu
E. H. HwangSungKyunKwan UniversityVerified email at skku.edu
Huamin LiAssociate Professor, University at BuffaloVerified email at buffalo.edu
Changsik KimSKKU Advanced Institute of Nano Technology, Sungkyunkwan UniversityVerified email at skku.edu
Zheng YangKing Abdullah University of Science and TechnologyVerified email at kaust.edu.sa
Kenji WatanabeNational Institute for Materials ScienceVerified email at nims.go.jp
Changgu LeeSungkyunkwan UniversityVerified email at skku.edu
Ganesh SamudraAssociate Professor, National University of SingaporeVerified email at nus.edu.sg
Tien Dat NgoimecVerified email at imec.be
Wan Sik HwangKorea Aerospace UniversityVerified email at kau.ac.kr
James T. TeheraniGaN Device Development and Process Integration Engineer, Texas InstrumentsVerified email at ti.com
Yee-Chia YeoNational University of SingaporeVerified email at nus.edu.sg
T.TaniguchiNational Institute for Materials ScienceVerified email at nims.go.jp
Ankur NipaneIntel CorporationVerified email at intel.com
Albert ChinNational Yang Ming Chiao Tung UniversityVerified email at nycu.edu.tw