Get my own profile
Public access
View all256 articles
62 articles
available
not available
Based on funding mandates
Co-authors
Darrell G. SchlomCornell UniversityVerified email at cornell.edu
Xingxu Yan (闫星旭)University of California, IrvineVerified email at uci.edu
Chang-Beom EomUniversity of Wisconsin-MadisonVerified email at engr.wisc.edu
mingjie xuIrvine Material Research Institute. University of California, IrvineVerified email at uci.edu
Long-Qing ChenPenn StateVerified email at psu.edu
Sheng Dai (戴升)East China University of Science and TechnologyVerified email at ecust.edu.cn
Seung Hyub BaekKorea Institute of Science and Technology (KIST)Verified email at kist.re.kr
Prof Peng WangUniversity of WarwickVerified email at warwick.ac.uk
Linze LiTEM engineer @ Micron Tech. Realtor®.Verified email at micron.com
Haiping SunUniversity of MichiganVerified email at umich.edu
R. RAMESHUniversity of California, BerkeleyVerified email at berkeley.edu
Peng GAO (高鹏)International Center for Quantum Materials, and Electron Microscopy Laboratory, Peking UniversityVerified email at pku.edu.cn
Chaitanya GadreGraduate Student ResearcherVerified email at uci.edu
Shuyi ZhangUniversity of MichiganVerified email at umich.edu
Lin XieSouthern University of Science and TechnologyVerified email at sustech.edu.cn
Mark RzchowskiProfessor of Physics, University of Wisconsin-MadisonVerified email at wisc.edu
Ruqian WuUniversity of California, IrvineVerified email at uci.edu
Yuefeng NieNanjing UniversityVerified email at nju.edu.cn
Ho Won JangDepatment of Materials Science and Engineering, Seoul National UniversityVerified email at snu.ac.kr
Huaixun HuyanHardware development Engineer, Western DigitalVerified email at wdc.com