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- Robert M. WallaceUniversity of Texas at DallasVerified email at utdallas.edu
- Christopher HinkleUniversity of Notre Dame, Electrical EngineeringVerified email at nd.edu
- Lanxia ChengStaff Engineer_EMD ElectronicsVerified email at emdgroup.com
- Bongki LeeTechnology Development Engineer, GLOBALFOUNDRIESVerified email at globalfoundries.com
- Luigi ColomboUniversity of Texas at DallasVerified email at utdallas.edu
- Stephen McDonnellUniversity of VirginiaVerified email at virginia.edu
- Si Joon KimAssociate Professor, Kangwon National UniversityVerified email at kangwon.ac.kr
- Hyunjung ShinSungkyunkwan UniversityVerified email at skku.edu
- Jaidah MohanSenior Process Development EngineerVerified email at micron.com
- Harrison Sejoon KimIntel ATTDVerified email at intel.com
- Greg MordiThe University of Texas at DallasVerified email at utdallas.edu
- Barry BrennanAtlantic Technological UniversityVerified email at atu.ie
- Rafik AddouOregon State UniversityVerified email at oregonstate.edu
- Hong DongNankai UniversityVerified email at nankai.edu.cn
- Eric M VogelHightower Professor of Materials Science and Engineering, Georgia Institute of TechnologyVerified email at mse.gatech.edu
- Jinho AhnProfessor of Materials Science and Engineering, Hanyang UniversityVerified email at hanyang.ac.kr
- Yves Jean ChabalUniversity of Texas at DallasVerified email at utdallas.edu
- Srikar JandhyalaEngineering Manager, Intel CorporationVerified email at intel.com
- Myung Mo SungHanyang University, Chemistry DepartmentVerified email at HANYANG.AC.KR
- Francisco Servando Aguirre-TostadoCentro de Investigación en Materiales Avanzados, S.C., Unidad MonterreyVerified email at cimav.edu.mx
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Jiyoung Kim
Professor, Department of Materials Science and Engineering, University of Texas at Dallas
Verified email at utdallas.edu - Homepage