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Hui Min Lee
Hui Min Lee
A*STAR Institute of High Performance Computing
Verified email at ihpc.a-star.edu.sg
Title
Cited by
Cited by
Year
Compact wideband equivalent-circuit model for electrical modeling of through-silicon via
EX Liu, EP Li, WB Ewe, HM Lee, TG Lim, S Gao
IEEE transactions on microwave theory and techniques 59 (6), 1454-1460, 2011
862011
A robust parameter design of wide band DGS filter for common-mode noise mitigation in high-speed electronics
XK Gao, HM Lee, SP Gao
IEEE Transactions on Electromagnetic Compatibility 59 (6), 1735-1740, 2017
202017
Two-dimensional discontinuous Galerkin time-domain method for modeling of arbitrarily shaped power-ground planes
HM Lee, S Gao, EX Liu, GS Samudra, EP Li
IEEE Transactions on Electromagnetic Compatibility 57 (6), 1744-1747, 2015
162015
A compact common-mode noise suppression filter for high speed differential signals using defected ground structure
XK Gao, HM Lee, S Gao, EX Liu, CE Png
2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC), 685-688, 2015
122015
Multi-physics modeling of through-silicon vias with equivalent-circuit approach
EX Liu, EP Li, WB Ewe, HM Lee
19th Topical Meeting on Electrical Performance of Electronic Packaging and …, 2010
102010
Electromagnetic behavior analysis of aircraft composite under lightning direct effect
RXK Gao, HM Lee, SP Gao
2017 International Symposium on Electromagnetic Compatibility-EMC EUROPE, 1-5, 2017
82017
Common-mode filter using cavity-backed defected ground structure for multilayer PCB
SP Gao, HM Lee, XK Gao, P Yu, C Zhan, X Feng, EX Liu, CE Png
2016 Asia-Pacific International Symposium on Electromagnetic Compatibility …, 2016
82016
Impact of TSV induced thermo-mechanical stress on semiconductor device performance
HM Lee, EX Liu, GS Samudra, EP Li
2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium …, 2012
82012
Fast-convergent expression for the barrel-plate capacitance in the physics-based via circuit model
SP Gao, F de Paulis, EX Liu, A Orlandi, HM Lee
IEEE Microwave and Wireless Components Letters 28 (5), 368-370, 2018
72018
Different designs of TSVs for 3D IC: signal integrity analysis with cascaded scattering matrix
EX Liu, HM Lee, XC Wei, EP Li
2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium …, 2011
72011
Effective modeling of multidirectional CFRP panels based on characterizing unidirectional samples for studying the lightning direct effect
SP Gao, HM Lee, RXK Gao, QF Lim, W Thitsartarn, EX Liu, CE Png
2017 XXXIInd General Assembly and Scientific Symposium of the International …, 2017
62017
Lightning direct effect and electromagnetic shielding analysis of conductive aircraft composite
RXK Gao, HM Lee, Z Yang, W Thitsartarn, SP Gao, EX Liu
2019 International Symposium on Electromagnetic Compatibility-EMC EUROPE …, 2019
32019
Power integrity modeling and measurement of TSV-based 3D IC system with application to the analysis of seven-chip stack
HM Lee, EX Liu, GS Samudra, EP Li, HY Li, KH Teo
IEEE Electromagnetic Compatibility Magazine 5 (3), 52-60, 2016
32016
Exploration of design guidelines for cavity-backed dumbbell-shaped DGS common-mode filters
SP Gao, HM Lee, RXK Gao, EX Liu, CE Png
2016 IEEE MTT-S International Conference on Numerical Electromagnetic and …, 2016
32016
Impact of technology scaling on electrical characteristics of through-silicon via correlated with equivalent circuits
HM Lee, EX Liu, EP Li, J Fuhrmann
10th International Symposium on Electromagnetic Compatibility, 339-344, 2011
32011
EMC design with embedded metamaterial technology
RXK Gao, SP Gao, HM Lee, W Yang
2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 …, 2018
22018
Effective resistance approach for DC analysis of power grid on through-silicon interposer (TSI)
EX Liu, JR Cubillo, EP Li, H Zhao, ZZ Oo, HM Lee
2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium …, 2012
22012
Electromagnetic characterization and measurement of conductive aircraft CFRP composite for lightning protection and EMI shielding
RXK Gao, HM Lee, WB Ewe, SW Tay, W Thitsartarn, Z Yang, M Mahmoudi, ...
IEEE Transactions on Instrumentation and Measurement, 2023
12023
Finite-difference time-domain method for multilayer carbon-fiber-reinforced polymer panel using tensorial conductivity matrix
Z Yang, HM Lee, SP Gao, RXK Gao, CE Png
2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 …, 2018
12018
Metamaterial-based common-mode noise filter with NGD effect for multilayer PCB
RXK Gao, SP Gao, HM Lee, EX Liu
Negative Group Delay Devices: From Concepts to Applications, 309-342, 2018
12018
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