| Compact wideband equivalent-circuit model for electrical modeling of through-silicon via EX Liu, EP Li, WB Ewe, HM Lee, TG Lim, S Gao IEEE transactions on microwave theory and techniques 59 (6), 1454-1460, 2011 | 86 | 2011 |
| A robust parameter design of wide band DGS filter for common-mode noise mitigation in high-speed electronics XK Gao, HM Lee, SP Gao IEEE Transactions on Electromagnetic Compatibility 59 (6), 1735-1740, 2017 | 21 | 2017 |
| Two-dimensional discontinuous Galerkin time-domain method for modeling of arbitrarily shaped power-ground planes HM Lee, S Gao, EX Liu, GS Samudra, EP Li IEEE Transactions on Electromagnetic Compatibility 57 (6), 1744-1747, 2015 | 16 | 2015 |
| A compact common-mode noise suppression filter for high speed differential signals using defected ground structure XK Gao, HM Lee, S Gao, EX Liu, CE Png 2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC), 685-688, 2015 | 13 | 2015 |
| Multi-physics modeling of through-silicon vias with equivalent-circuit approach EX Liu, EP Li, WB Ewe, HM Lee 19th Topical Meeting on Electrical Performance of Electronic Packaging and …, 2010 | 10 | 2010 |
| Fast-convergent expression for the barrel-plate capacitance in the physics-based via circuit model SP Gao, F de Paulis, EX Liu, A Orlandi, HM Lee IEEE Microwave and Wireless Components Letters 28 (5), 368-370, 2018 | 9 | 2018 |
| Electromagnetic behavior analysis of aircraft composite under lightning direct effect RXK Gao, HM Lee, SP Gao 2017 International Symposium on Electromagnetic Compatibility-EMC EUROPE, 1-5, 2017 | 8 | 2017 |
| Common-mode filter using cavity-backed defected ground structure for multilayer PCB SP Gao, HM Lee, XK Gao, P Yu, C Zhan, X Feng, EX Liu, CE Png 2016 Asia-Pacific International Symposium on Electromagnetic Compatibility …, 2016 | 8 | 2016 |
| Impact of TSV induced thermo-mechanical stress on semiconductor device performance HM Lee, EX Liu, GS Samudra, EP Li 2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium …, 2012 | 8 | 2012 |
| Different designs of TSVs for 3D IC: signal integrity analysis with cascaded scattering matrix EX Liu, HM Lee, XC Wei, EP Li 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium …, 2011 | 7 | 2011 |
| Effective modeling of multidirectional CFRP panels based on characterizing unidirectional samples for studying the lightning direct effect SP Gao, HM Lee, RXK Gao, QF Lim, W Thitsartarn, EX Liu, CE Png 2017 XXXIInd General Assembly and Scientific Symposium of the International …, 2017 | 6 | 2017 |
| Lightning direct effect and electromagnetic shielding analysis of conductive aircraft composite RXK Gao, HM Lee, Z Yang, W Thitsartarn, SP Gao, EX Liu 2019 International Symposium on Electromagnetic Compatibility-EMC EUROPE …, 2019 | 3 | 2019 |
| Power integrity modeling and measurement of TSV-based 3D IC system with application to the analysis of seven-chip stack HM Lee, EX Liu, GS Samudra, EP Li, HY Li, KH Teo IEEE Electromagnetic Compatibility Magazine 5 (3), 52-60, 2016 | 3 | 2016 |
| Exploration of design guidelines for cavity-backed dumbbell-shaped DGS common-mode filters SP Gao, HM Lee, RXK Gao, EX Liu, CE Png 2016 IEEE MTT-S International Conference on Numerical Electromagnetic and …, 2016 | 3 | 2016 |
| Impact of technology scaling on electrical characteristics of through-silicon via correlated with equivalent circuits HM Lee, EX Liu, EP Li, J Fuhrmann 10th International Symposium on Electromagnetic Compatibility, 339-344, 2011 | 3 | 2011 |
| EMC design with embedded metamaterial technology RXK Gao, SP Gao, HM Lee, W Yang 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 …, 2018 | 2 | 2018 |
| Effective resistance approach for DC analysis of power grid on through-silicon interposer (TSI) EX Liu, JR Cubillo, EP Li, H Zhao, ZZ Oo, HM Lee 2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium …, 2012 | 2 | 2012 |
| Electromagnetic characterization and measurement of conductive aircraft CFRP composite for lightning protection and EMI shielding RXK Gao, HM Lee, WB Ewe, SW Tay, W Thitsartarn, Z Yang, M Mahmoudi, ... IEEE Transactions on Instrumentation and Measurement, 2023 | 1 | 2023 |
| Finite-difference time-domain method for multilayer carbon-fiber-reinforced polymer panel using tensorial conductivity matrix Z Yang, HM Lee, SP Gao, RXK Gao, CE Png 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 …, 2018 | 1 | 2018 |
| Metamaterial-based common-mode noise filter with NGD effect for multilayer PCB RXK Gao, SP Gao, HM Lee, EX Liu Negative Group Delay Devices: From Concepts to Applications, 309-342, 2018 | 1 | 2018 |
