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Co-authors
- Axel HoffmannProfessor of Materials Science and Engineering, University of Illinois at Urbana-ChampaignVerified email at illinois.edu
- John PearsonArgonne National LaboratoryVerified email at anl.gov
- M. Benjamin JungfleischDepartment of Physics and Astronomy, University of DelawareVerified email at udel.edu
- Joseph SklenarWayne State UniversityVerified email at wayne.edu
- Jiang WanjunDepartment of Physics, Tsinghua UniversityVerified email at tsinghua.edu.cn
- Yi LiArgonne National LaboratoryVerified email at anl.gov
- novosad, v.Argonne National LaboratoryVerified email at anl.gov
- Suzanne G.E. te VelthuisArgonne National LaboratoryVerified email at anl.gov
- John KettersonNorthwestern UniversityVerified email at northwestern.edu
- Kang L. WangElectrical Engineering DepartmentVerified email at ee.ucla.edu
- Peng LiStanford UniversityVerified email at stanford.edu
- Junjia DingHardware Engineer, Verily Life SciencesVerified email at google.com
- Frank FradinArgonne National LaboratoryVerified email at anl.gov
- Kannan M KrishnanUniversity of WashingtonVerified email at uw.edu
- Wai-Kwong KwokArgonne National LaboratoryVerified email at anl.gov
- Frank FreimuthPostdoc, Forschungszentrum JülichVerified email at fz-juelich.de
- Yuriy MokrousovForschungszentrum Jülich, Johannes Gutenberg University MainzVerified email at fz-juelich.de
- Mingzhong WuDepartment of Physics, Colorado State UniversityVerified email at colostate.edu
- pramey upadhyayaPurdueVerified email at purdue.edu
- yizheng wufudan universityVerified email at fudan.edu.cn