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Kalhan Koul
Kalhan Koul
Ph.D. Candidate, Electrical Engineering, Stanford University
Verified email at stanford.edu
Title
Cited by
Cited by
Year
Out-of-plane electromechanical response of monolayer molybdenum disulfide measured by piezoresponse force microscopy
CJ Brennan, R Ghosh, K Koul, SK Banerjee, N Lu, ET Yu
Nano letters 17 (9), 5464-5471, 2017
1062017
CHIMERA: A 0.92 TOPS, 2.2 TOPS/W edge AI accelerator with 2 MByte on-chip foundry resistive RAM for efficient training and inference
M Giordano, K Prabhu, K Koul, RM Radway, A Gural, R Doshi, ZF Khan, ...
2021 symposium on VLSI circuits, 1-2, 2021
492021
CHIMERA: A 0.92-TOPS, 2.2-TOPS/W edge AI accelerator with 2-MByte on-chip foundry resistive RAM for efficient training and inference
K Prabhu, A Gural, ZF Khan, RM Radway, M Giordano, K Koul, R Doshi, ...
IEEE Journal of Solid-State Circuits 57 (4), 1013-1026, 2022
292022
Out-of-plane electromechanical coupling in transition metal dichalcogenides
CJ Brennan, K Koul, N Lu, ET Yu
Applied Physics Letters 116 (5), 2020
232020
Aha: An agile approach to the design of coarse-grained reconfigurable accelerators and compilers
K Koul, J Melchert, K Sreedhar, L Truong, G Nyengele, K Zhang, Q Liu, ...
ACM Transactions on Embedded Computing Systems 22 (2), 1-34, 2023
21*2023
Amber: A 367 GOPS, 538 GOPS/W 16nm SoC with a coarse-grained reconfigurable array for flexible acceleration of dense linear algebra
A Carsello, K Feng, T Kong, K Koul, Q Liu, J Melchert, G Nyengele, ...
2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and …, 2022
172022
Hardware Abstractions and Hardware Mechanisms to Support Multi-Task Execution on Coarse-Grained Reconfigurable Arrays
T Kong, K Koul, P Raina, M Horowitz, C Torng
22022
Cascade: An application pipelining toolkit for coarse-grained reconfigurable arrays
J Melchert, Y Mei, K Koul, Q Liu, M Horowitz, P Raina
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 2024
12024
Amber: Coarse-grained reconfigurable array-based soc for dense linear algebra acceleration
K Feng, A Carsello, T Kong, K Koul, Q Liu, J Melchert, G Nyengele, ...
2022 IEEE Hot Chips 34 Symposium (HCS), 1-30, 2022
12022
Amber: A 16-nm System-on-Chip With a Coarse-Grained Reconfigurable Array for Flexible Acceleration of Dense Linear Algebra
K Feng, T Kong, K Koul, J Melchert, A Carsello, Q Liu, G Nyengele, ...
IEEE Journal of Solid-State Circuits, 2023
2023
(Invited) Strain and Electromechanical Coupling at the Nanoscale in Atomically Thin Transition Metal Dichalcogenides
ET Yu, Z Zhang, CJ Brennan, AC De Palma, G Cossio, K Koul
Electrochemical Society Meeting Abstracts aimes2018, 706-706, 2018
2018
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Articles 1–11