| Real-time compression of point cloud streams J Kammerl, N Blodow, RB Rusu, S Gedikli, M Beetz, E Steinbach 2012 IEEE international conference on robotics and automation, 778-785, 2012 | 451 | 2012 |
| Application-driven cross-layer optimization for video streaming over wireless networks S Khan, Y Peng, E Steinbach, M Sgroi, W Kellerer IEEE communications Magazine 44 (1), 122-130, 2006 | 369 | 2006 |
| Adaptive media playout for low-delay video streaming over error-prone channels M Kalman, E Steinbach, B Girod IEEE Transactions on Circuits and Systems for Video Technology 14 (6), 841-851, 2004 | 312 | 2004 |
| Toward haptic communications over the 5G tactile Internet K Antonakoglou, X Xu, E Steinbach, T Mahmoodi, M Dohler IEEE Communications Surveys & Tutorials 20 (4), 3034-3059, 2018 | 270 | 2018 |
| Standard compatible extension of H. 263 for robust video transmission in mobile environments E Steinbach, N Farber, B Girod IEEE Transactions on Circuits and Systems for Video Technology 7 (6), 872-881, 1997 | 251 | 1997 |
| Haptic communications E Steinbach, S Hirche, M Ernst, F Brandi, R Chaudhari, J Kammerl, ... Proceedings of the IEEE 100 (4), 937-956, 2012 | 232 | 2012 |
| Perception-based data reduction and transmission of haptic data in telepresence and teleaction systems P Hinterseer, S Hirche, S Chaudhuri, E Steinbach, M Buss IEEE Transactions on Signal Processing 56 (2), 588-597, 2008 | 232 | 2008 |
| The IEEE 1918.1 “tactile internet” standards working group and its standards O Holland, E Steinbach, RV Prasad, Q Liu, Z Dawy, A Aijaz, N Pappas, ... Proceedings of the IEEE 107 (2), 256-279, 2019 | 191 | 2019 |
| Graph-based data fusion of pedometer and WiFi measurements for mobile indoor positioning S Hilsenbeck, D Bobkov, G Schroth, R Huitl, E Steinbach Proceedings of the 2014 ACM international joint conference on pervasive and …, 2014 | 175 | 2014 |
| Disposal of explosive ordnances by use of a bimanual haptic telepresence system A Kron, G Schmidt, B Petzold, MI Zah, P Hinterseer, E Steinbach IEEE International Conference on Robotics and Automation, 2004. Proceedings …, 2004 | 162 | 2004 |
| Multimodal feature-based surface material classification M Strese, C Schuwerk, A Iepure, E Steinbach IEEE transactions on haptics 10 (2), 226-239, 2016 | 156 | 2016 |
| Mobile visual location recognition G Schroth, R Huitl, D Chen, M Abu-Alqumsan, A Al-Nuaimi, E Steinbach IEEE Signal Processing Magazine 28 (4), 77-89, 2011 | 153 | 2011 |
| Haptic codecs for the tactile internet E Steinbach, M Strese, M Eid, X Liu, A Bhardwaj, Q Liu, M Al-Ja’afreh, ... Proceedings of the IEEE 107 (2), 447-470, 2018 | 152 | 2018 |
| QoE-Driven Cross-Layer Optimization for High Speed Downlink Packet Access. S Thakolsri, S Khan, EG Steinbach, W Kellerer J. Commun. 4 (9), 669-680, 2009 | 144 | 2009 |
| MOS‐based multiuser multiapplication cross‐layer optimization for mobile multimedia communication S Khan, S Duhovnikov, E Steinbach, W Kellerer Advances in Multimedia 2007 (1), 094918, 2007 | 141 | 2007 |
| Multi-hypothesis, volumetric reconstruction of 3-D objects from multiple calibrated camera views P Eisert, E Steinbach, B Girod 1999 IEEE International Conference on Acoustics, Speech, and Signal …, 1999 | 141 | 1999 |
| Apparatus and method for controlling an operation of a plurality of communication layers W Kellerer, E Steinbach, LU Choi US Patent 7,609,652, 2009 | 133 | 2009 |
| Deep learning for surface material classification using haptic and visual information H Zheng, L Fang, M Ji, M Strese, Y Özer, E Steinbach IEEE Transactions on Multimedia 18 (12), 2407-2416, 2016 | 130 | 2016 |
| Adaptive 5G low-latency communication for tactile internet services J Sachs, LAA Andersson, J Araújo, C Curescu, J Lundsjö, G Rune, ... Proceedings of the IEEE 107 (2), 325-349, 2018 | 127 | 2018 |
| TUMindoor: An extensive image and point cloud dataset for visual indoor localization and mapping R Huitl, G Schroth, S Hilsenbeck, F Schweiger, E Steinbach 2012 19th IEEE International Conference on Image Processing, 1773-1776, 2012 | 125 | 2012 |
Bernd GirodProfessor of Electrical Engineering, Stanford UniversityVerified email at stanford.edu
