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Charan Surisetty
Charan Surisetty
Verified email at us.ibm.com - Homepage
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Cited by
Year
A 7nm FinFET technology featuring EUV patterning and dual strained high mobility channels
R Xie, P Montanini, K Akarvardar, N Tripathi, B Haran, S Johnson, T Hook, ...
2016 IEEE international electron devices meeting (IEDM), 2.7. 1-2.7. 4, 2016
1462016
A 10nm platform technology for low power and high performance application featuring FINFET devices with multi workfunction gate stack on bulk and SOI
KI Seo, B Haran, D Gupta, D Guo, T Standaert, R Xie, H Shang, E Alptekin, ...
2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical …, 2014
1002014
Tungsten and cobalt metallization: A material study for MOL local interconnects
V Kamineni, M Raymond, S Siddiqui, F Mont, S Tsai, C Niu, A Labonte, ...
2016 IEEE International Interconnect Technology Conference/Advanced …, 2016
502016
Strained FinFET by epitaxial stressor independent of gate pitch
K Cheng, P Hashemi, A Khakifirooz, A Reznicek, CVVS Surisetty
US Patent 9,647,113, 2017
492017
Strained FinFET by epitaxial stressor independent of gate pitch
K Cheng, P Hashemi, A Khakifirooz, A Reznicek, CVVS Surisetty
US Patent 9,647,113, 2017
492017
Air spacer for 10nm FinFET CMOS and beyond
K Cheng, C Park, C Yeung, S Nguyen, J Zhang, X Miao, M Wang, ...
2016 IEEE International Electron Devices Meeting (IEDM), 17.1. 1-17.1. 4, 2016
492016
Embedded interlevel dielectric barrier layers for replacement metal gate field effect transistors
K Cheng, A Khakifirooz, A Reznicek, CV Surisetty
US Patent 9,059,164, 2015
462015
Methods of forming replacement gate structures on semiconductor devices and the resulting device
R Xie, P Shom, C Jin, CVVS Surisetty
US Patent 8,772,101, 2014
412014
Bottom oxidation through STI (BOTS)—A novel approach to fabricate dielectric isolated FinFETs on bulk substrates
K Cheng, S Seo, J Faltermeier, D Lu, T Standaert, I Ok, A Khakifirooz, ...
2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical …, 2014
332014
Method of forming contact useful in replacement metal gate processing and related semiconductor structure
B Pranatharthiharan, OK Injo, CVVS Surisetty
US Patent 9,337,094, 2016
262016
Dielectric cap layer for replacement gate with self-aligned contact
B Pranatharthiharan, CVVS Surisetty, J Wang, CS Park, R Xie
US Patent App. 13/672,864, 2014
252014
Nanosheet isolation for bulk CMOS non-planar devices
B Pranatharthiharan, OK Injo, SC Seo, CVVS Surisetty
US Patent 9,871,099, 2018
242018
Cleaning solutions for ultrathin Co barriers for advanced technology nodes
SR Alety, URK Lagudu, R Popuri, R Patlolla, CVVS Surisetty, SV Babu
ECS Journal of Solid State Science and Technology 6 (9), P671, 2017
222017
Highly-selective superconformai CVD Ti silicide process enabling area-enhanced contacts for next-generation CMOS architectures
N Breil, A Carr, T Kuratomi, C Lavoie, IC Chen, M Stolfi, KD Chiu, W Wang, ...
2017 Symposium on VLSI Technology, T216-T217, 2017
222017
Methods for replacing gate sidewall materials with a low-k spacer
K Cheng, A Khakifirooz, A Reznicek, CVVS Surisetty
US Patent 9,349,835, 2016
22*2016
Dissolution inhibition in Cu-CMP using dodecyl-benzene-sulfonic acid surfactant with oxalic acid and glycine as complexing agents
C Surisetty, PC Goonetilleke, D Roy, SV Babu
Journal of The Electrochemical Society 155 (12), H971, 2008
222008
Oxalic-acid-based slurries with tunable selectivity for copper and tantalum removal in CMP
S Janjam, C Surisetty, S Pandija, D Roy, SV Babu
Electrochemical and Solid-State Letters 11 (3), H66, 2008
222008
Borderless contacts for semiconductor transistors
K Cheng, A Khakifirooz, A Reznicek, R Sreenivasan, CV Surisetty, ...
US Patent 8,728,927, 2014
212014
Semiconductor device replacement metal gate with gate cut last in RMG
AM Greene, BP Haran, OK Injo, CV Surisetty
US Patent 10,381,458, 2019
202019
Semiconductor device with low-k gate cap and self-aligned contact
K Cheng, A Khakifirooz, A Reznicek, CVVS Surisetty
US Patent 9,293,576, 2016
202016
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