| A 7nm FinFET technology featuring EUV patterning and dual strained high mobility channels R Xie, P Montanini, K Akarvardar, N Tripathi, B Haran, S Johnson, T Hook, ... 2016 IEEE international electron devices meeting (IEDM), 2.7. 1-2.7. 4, 2016 | 174 | 2016 |
| A 10nm platform technology for low power and high performance application featuring FINFET devices with multi workfunction gate stack on bulk and SOI KI Seo, B Haran, D Gupta, D Guo, T Standaert, R Xie, H Shang, E Alptekin, ... 2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical …, 2014 | 108 | 2014 |
| Tungsten and cobalt metallization: A material study for MOL local interconnects V Kamineni, M Raymond, S Siddiqui, F Mont, S Tsai, C Niu, A Labonte, ... 2016 IEEE International Interconnect Technology Conference/Advanced …, 2016 | 57 | 2016 |
| Embedded interlevel dielectric barrier layers for replacement metal gate field effect transistors K Cheng, A Khakifirooz, A Reznicek, CV Surisetty US Patent 9,059,164, 2015 | 56 | 2015 |
| Air spacer for 10nm FinFET CMOS and beyond K Cheng, C Park, C Yeung, S Nguyen, J Zhang, X Miao, M Wang, ... 2016 IEEE International Electron Devices Meeting (IEDM), 17.1. 1-17.1. 4, 2016 | 53 | 2016 |
| Strained FinFET by epitaxial stressor independent of gate pitch K Cheng, P Hashemi, A Khakifirooz, A Reznicek, CVVS Surisetty US Patent 9,647,113, 2017 | 52 | 2017 |
| Strained FinFET by epitaxial stressor independent of gate pitch K Cheng, P Hashemi, A Khakifirooz, A Reznicek, CVVS Surisetty US Patent 9,647,113, 2017 | 52 | 2017 |
| Stable contact on one-sided gate tie-down structure OK Injo, B Pranatharthiharan, SC Seo, CVVS Surisetty US Patent 9,685,340, 2017 | 44 | 2017 |
| Methods of forming replacement gate structures on semiconductor devices and the resulting device R Xie, P Shom, C Jin, CVVS Surisetty US Patent 8,772,101, 2014 | 44 | 2014 |
| Bottom oxidation through STI (BOTS)—A novel approach to fabricate dielectric isolated FinFETs on bulk substrates K Cheng, S Seo, J Faltermeier, D Lu, T Standaert, I Ok, A Khakifirooz, ... 2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical …, 2014 | 35 | 2014 |
| Cleaning solutions for ultrathin Co barriers for advanced technology nodes SR Alety, URK Lagudu, R Popuri, R Patlolla, CVVS Surisetty, SV Babu ECS Journal of Solid State Science and Technology 6 (9), P671, 2017 | 31 | 2017 |
| Nanosheet isolation for bulk CMOS non-planar devices B Pranatharthiharan, OK Injo, SC Seo, CVVS Surisetty US Patent 9,871,099, 2018 | 28 | 2018 |
| Method of forming contact useful in replacement metal gate processing and related semiconductor structure B Pranatharthiharan, OK Injo, CVVS Surisetty US Patent 9,337,094, 2016 | 27 | 2016 |
| Dielectric cap layer for replacement gate with self-aligned contact B Pranatharthiharan, CVVS Surisetty, J Wang, CS Park, R Xie US Patent App. 13/672,864, 2014 | 26 | 2014 |
| Semiconductor device replacement metal gate with gate cut last in RMG AM Greene, BP Haran, OK Injo, CV Surisetty US Patent 10,381,458, 2019 | 25 | 2019 |
| Highly-selective superconformai CVD Ti silicide process enabling area-enhanced contacts for next-generation CMOS architectures N Breil, A Carr, T Kuratomi, C Lavoie, IC Chen, M Stolfi, KD Chiu, W Wang, ... 2017 Symposium on VLSI Technology, T216-T217, 2017 | 23 | 2017 |
| Methods for replacing gate sidewall materials with a low-k spacer K Cheng, A Khakifirooz, A Reznicek, CVVS Surisetty US Patent 9,349,835, 2016 | 23* | 2016 |
| Dissolution inhibition in Cu-CMP using dodecyl-benzene-sulfonic acid surfactant with oxalic acid and glycine as complexing agents C Surisetty, PC Goonetilleke, D Roy, SV Babu Journal of The Electrochemical Society 155 (12), H971, 2008 | 23 | 2008 |
| Oxalic-acid-based slurries with tunable selectivity for copper and tantalum removal in CMP S Janjam, C Surisetty, S Pandija, D Roy, SV Babu Electrochemical and Solid-State Letters 11 (3), H66, 2008 | 23 | 2008 |
| Borderless contacts for semiconductor transistors K Cheng, A Khakifirooz, A Reznicek, R Sreenivasan, CV Surisetty, ... US Patent 8,728,927, 2014 | 22 | 2014 |
