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Co-authors
- Clifford HubbardUS ARLVerified email at mail.mil
- William NothwangUS Army Research LaboratoryVerified email at mail.mil
- Pooran JoshiOak Ridge National LaboratoryVerified email at ornl.gov
- S. Pamir AlpayProfessor of Materials Science and Engineering, University of ConnecticutVerified email at uconn.edu
- John Derek DemareeMaterials Engineer, DEVCOM Army Research LaboratoryVerified email at army.mil
- Wendy SarneyDEVCOM Army Research LaboratoryVerified email at army.mil
- Erik EnriquezDepartment of Computer Science, University of Texas Rio Grande ValleyVerified email at utrgv.edu
- Greg P. CarmanUCLAVerified email at seas.ucla.edu
- Adrian PodpirkaPhD, Johns Hopkins Univeristy Applied Physics LaboratoryVerified email at jhuapl.edu
- Robert Carter IIIU.S. Army Futures CommandVerified email at mail.mil
- Christopher J. K. RichardsonUniversity of MarylandVerified email at lps.umd.edu
- Kang Xu (许康)MRS Fellow, ECS Fellow, ARL Fellow (emeritus), Chief Scientist at SES AIVerified email at ses.ai
- Joe WellsIndependent ConsultantVerified email at alum.mit.edu