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Kuang (K.C.) Liu
Kuang (K.C.) Liu
Verified email at intel.com
Title
Cited by
Cited by
Year
Fatigue Life Prediction Using Hybrid Prognosis for Structural Health Monitoring
RK Neerukatti, KC Liu, Y Liu, A Chattopadhyay
Infotech@Aerospace 2012, DOI: 10.2514/6.2012-2448, 2012
602012
Validity of random microstructures simulation in fiber-reinforced composite materials
KC Liu, A Ghoshal
Composites Part B: Engineering 57, 56-70, 2014
502014
Crack initiation and fatigue life prediction on aluminum lug joints using statistical volume element–based multiscale modeling
J Zhang, K Liu, C Luo, A Chattopadhyay
Journal of Intelligent Material Systems and Structures 24 (17), 2097-2109, 2013
332013
From ordered to disordered: The effect of microstructure on composite mechanical performance
LB Borkowski, KC Liu, A Chattopadhyay
CMC Comput Mater Contin 37, 161-193, 2013
212013
Micromechanics based multiscale modeling of the inelastic response and failure of complex architecture composites
K Liu
Arizona State University, 2011
212011
Influence of scale specific features on the progressive damage of woven ceramic matrix composites (CMCs)
KC Liu, SM Arnold
CMC: Computers, Materials & Continua 35 (1), 35-65, 2013
182013
Inherent symmetry and microstructure ambiguity in micromechanics
KC Liu, A Ghoshal
Composite Structures 108, 311-318, 2014
172014
Fully coupled electromechanical elastodynamic model for guided wave propagation analysis
L Borkowski, K Liu, A Chattopadhyay
Journal of Intelligent Material Systems and Structures 24 (13), 1647-1663, 2013
162013
Damage detection technique using ultrasonic guided waves and outlier detection: Application to interface delamination diagnosis of integrated circuit package
H Lee, B Koo, A Chattopadhyay, RK Neerukatti, KC Liu
Mechanical Systems and Signal Processing 160, 107884, 2021
152021
Damage precursor investigation of fiber-reinforced composite materials under fatigue loads
AJ Hall, IV Brennan, E Raymond, A Ghoshal, KC Liu, M Coatney, ...
Army Research Lab Aberdeen Proving Ground MD Vehicle Technology Directorate, 2013
152013
Impact of material and architecture model parameters on the failure of woven CMCs via the multiscale generalized method of cells
K Liu, A Chattopadhyay, SM Arnold
Developments in Strategic Materials and Computational Design II: Ceramic …, 2011
152011
CPU package substrates with removable memory mechanical interfaces
M Prakash, TT Holden, JL Smalley, RS Viswanath, BN Coury, D Ziakas, ...
US Patent 9,832,876, 2017
142017
Mechanical properties and damage characterization of triaxial braided composites in environmental conditions
JP Johnston, KC Liu, M Yekani Fard, A Chattopadhyay
Journal of Composite Materials 51 (1), 67-80, 2017
132017
Characterization of impact damage in woven fiber composites using fiber Bragg grating sensing and NDE
C Hiche, KC Liu, M Seaver, J Wei, A Chattopadhyay
Nondestructive Characterization for Composite Materials, Aerospace …, 2009
122009
Impact of material and architecture model parameters on the failure of woven ceramic matrix composites (CMCs) via the multiscale generalized method of cells
KC Liu, SM Arnold
35th International Conference and Exposition on Advanced Ceramics and …, 2011
112011
Pressure features to alter the shape of a socket
SA Klein, K Liu, S Nekkanty, F Mohammad, DT Tran, S Aravamudhan, ...
US Patent App. 16/833,221, 2021
62021
Guided wave based fatigue crack detection and localization in aluminum aerospace structures
K Hensberry, N Kovvali, KC Liu, A Chattopadhyay, ...
Smart Materials, Adaptive Structures and Intelligent Systems 45097, 907-916, 2012
62012
Low Speed Projectile Impact Damage Prediction and Propagation in Woven Composites
KC Liu, C Hiche, A Chattopadhyay
50th AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics, and Materials …, 2009
62009
Detection of Sealant Delamination in Integrated Circuit Package Using Nondestructive Evaluation
G Li, H Lee, A Chattopadhyay, R Kumar Neerukatti, KC Liu
Journal of Electronic Packaging 143 (1), 011002, 2021
52021
Electronic device, socket, and spacer to alter socket profile
SA Klein, K Liu, TA Boyd, LG Rangel, M Mukadem, SA Ferguson, ...
US Patent 10,455,685, 2019
52019
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Articles 1–20