Follow
Joo Hwan Shin
Title
Cited by
Cited by
Year
MXene/polymer hybrid materials for flexible AC-filtering electrochemical capacitors
GS Gund, JH Park, R Harpalsinh, M Kota, JH Shin, T Kim, Y Gogotsi, ...
Joule 3 (1), 164-176, 2019
2752019
Cuticular pad–inspired selective frequency damper for nearly dynamic noise–free bioelectronics
B Park, JH Shin, J Ok, S Park, W Jung, C Jeong, S Choy, YJ Jo, T Kim
Science 376 (6593), 624-629, 2022
832022
Biocompatible and biodegradable organic transistors using a solid‐state electrolyte incorporated with choline‐based ionic liquid and polysaccharide
YJ Jo, H Kim, J Ok, YJ Shin, JH Shin, TH Kim, Y Jung, T Kim
Advanced Functional Materials 30 (29), 1909707, 2020
652020
Injectable biomedical devices for sensing and stimulating internal body organs
YH Jung, JU Kim, JS Lee, JH Shin, W Jung, J Ok, T Kim
Advanced Materials 32 (16), 1907478, 2020
582020
Strain‐visualization with ultrasensitive nanoscale crack‐based sensor assembled with hierarchical thermochromic membrane
B Park, JU Kim, J Kim, D Tahk, C Jeong, J Ok, JH Shin, D Kang, T Kim
Advanced Functional Materials 29 (40), 1903360, 2019
452019
Wearable EEG electronics for a Brain–AI Closed-Loop System to enhance autonomous machine decision-making
JH Shin, J Kwon, JU Kim, H Ryu, J Ok, S Joon Kwon, H Park, T Kim
npj Flexible Electronics 6 (1), 32, 2022
312022
Highly stretchable and strain‐insensitive liquid metal based elastic kirigami electrodes (LM‐eKE)
H Choi, Y Luo, G Olson, P Won, JH Shin, J Ok, YJ Yang, T Kim, C Majidi
Advanced Functional Materials 33 (30), 2301388, 2023
242023
Stretchable, patch‐type calorie‐expenditure measurement device based on pop‐up shaped nanoscale crack‐based sensor
KY Kwon, YJ Shin, JH Shin, C Jeong, YH Jung, B Park, T Kim
Advanced Healthcare Materials 8 (19), 1801593, 2019
242019
Nanoscale‐Dewetting‐Based Direct Interconnection of Microelectronics for a Deterministic Assembly of Transfer Printing
JS Lee, SJ Kang, JH Shin, YJ Shin, B Lee, JM Koo, T Kim
Advanced Materials 32 (21), 1908422, 2020
202020
Releasable high‐performance GaAs Schottky diodes for gigahertz operation of flexible bridge rectifier
YH Jung, H Zhang, IK Lee, JH Shin, T Kim, Z Ma
Advanced Electronic Materials 5 (2), 1800772, 2019
172019
Non-yellowish and heat-resistant adhesive for a transparent heat sinking film
H Ryu, H Choi, J hwan Shin, H Hong, B Park, EG Lee, T Kim
Journal of Industrial and Engineering Chemistry 103, 275-282, 2021
22021
Biodegradable Organic Transistors: Biocompatible and Biodegradable Organic Transistors Using a Solid‐State Electrolyte Incorporated with Choline‐Based Ionic Liquid and …
YJ Jo, H Kim, J Ok, YJ Shin, JH Shin, TH Kim, Y Jung, T Kim
Advanced Functional Materials 30 (29), 2020
22020
Polymeric Conductive Adhesive based Ultrathin Epidermal Electrodes for Long‐term Monitoring of Electrophysiological Signals
JH Shin, JY Choi, K June, H Choi, T Kim
Advanced Materials, 2313157, 2024
2024
Highly Stretchable and Strain‐Insensitive Liquid Metal based Elastic Kirigami Electrodes (LM‐eKE)(Adv. Funct. Mater. 30/2023)
H Choi, Y Luo, G Olson, P Won, JH Shin, J Ok, YJ Yang, T Kim, C Majidi
Advanced Functional Materials 33 (30), 2370183, 2023
2023
Wearable device and wearable system
SK Paik, TI Kim, JH Shin
US Patent 11,550,390, 2023
2023
User interface system and an operation method thereof
SK Paik, TI Kim, JH Shin
US Patent App. 16/940,150, 2021
2021
Nanoscale Dewetting: Nanoscale‐Dewetting‐Based Direct Interconnection of Microelectronics for a Deterministic Assembly of Transfer Printing (Adv. Mater. 21/2020)
JS Lee, SJ Kang, JH Shin, YJ Shin, B Lee, JM Koo, T Kim
Advanced Materials 32 (21), 2070161, 2020
2020
The system can't perform the operation now. Try again later.
Articles 1–17