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Chen Xu
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Enhanced strength and temperature dependence of mechanical properties of Li at small scales and its implications for Li metal anodes
C Xu, Z Ahmad, A Aryanfar, V Viswanathan, JR Greer
Proceedings of the National Academy of Sciences 114 (1), 57-61, 2017
2482017
Three-Dimensional Au Microlattices as Positive Electrodes for Li–O2 Batteries
C Xu, BM Gallant, PU Wunderlich, T Lohmann, JR Greer
ACS nano 9 (6), 5876-5883, 2015
942015
Atomic layer deposition and etch in a single plasma chamber for critical dimension control
X Zhou, Y Kimura, D Zhang, C Xu, G Upadhyaya, M Brooks
US Patent 10,734,238, 2020
162020
Molecular structure of highly excited resonant states in Mg 24 and the corresponding Be 8+ O 16 and C 12+ C 12 decays
C Xu, C Qi, RJ Liotta, R Wyss, SM Wang, FR Xu, DX Jiang
Physical Review C 81 (5), 054319, 2010
152010
Atomic layer deposition and etch for reducing roughness
US Patent 20,190,157,066, 2019
10*2019
Alpha-particle decays from excited states in 24Mg
SM Wang, C Xu, RJ Liotta, C Qi, FR Xu, DX Jiang
Science China Physics, Mechanics and Astronomy 54, 130-135, 2011
52011
Atomic layer deposition and etch for reducing roughness
X Zhou, N Ansari, Y Kimura, SYY Li, K Sultana, R Mani, D Zhang, H Kazi, ...
US Patent 11,170,997, 2021
22021
Integrated atomic layer passivation in TCP etch chamber and in-situ etch-ALP method
X Zhou, TA Kamp, Y Kimura, D Zhang, C Xu, J Drewery, A Paterson
US Patent 10,950,454, 2021
22021
Atomic layer deposition and etch in a single plasma chamber for critical dimension control
X Zhou, Y Kimura, D Zhang, C Xu, G Upadhyaya, M Brooks
US Patent 11,211,253, 2021
12021
Integrated atomic layer passivation in tcp etch chamber and in-situ etch-alp method
X Zhou, TA Kamp, Y Kimura, D Zhang, C Xu, J Drewery, A Paterson
US Patent App. 17/200,526, 2021
2021
INTEGRATED ATOMIC LAYER PASSIVATION IN TCP ETCHING CHAMBER AND ALP IN SITU ETCHING METHOD
X Zhou, TA Kamp, Y Kimura, D ZHANG, C Xu, J Drewery, A Paterson
2019
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