Follow
Stan Tsai
Stan Tsai
EMD Electronic
Verified email at EMDgroup.com
Title
Cited by
Cited by
Year
A 7nm FinFET technology featuring EUV patterning and dual strained high mobility channels
R Xie, P Montanini, K Akarvardar, N Tripathi, B Haran, S Johnson, T Hook, ...
2016 IEEE international electron devices meeting (IEDM), 2.7. 1-2.7. 4, 2016
1752016
Method and apparatus for electrochemical-mechanical planarization
L Sun, SD Tsai, FC Redeker
US Patent 6,379,223, 2002
1492002
Method and composition for polishing a substrate
FQ Liu, SD Tsai, Y Hu, SS Neo, Y Wang, A Duboust, LY Chen
US Patent 7,128,825, 2006
1082006
Electrolyte with good planarization capability, high removal rate and smooth surface finish for electrochemically controlled copper CMP
L Sun, FQ Liu, S Neo, S Tsai, LY Chen
US Patent 6,863,797, 2005
1022005
Conductive polishing article for electrochemical mechanical polishing
Y Hu, Y Wang, A Duboust, FQ Liu, AP Manens, SS Neo, SD Tsai, ...
US Patent 6,991,528, 2006
1002006
Method and apparatus for enhanced CMP using metals having reductive properties
SD Tsai, Y Wang, K Wijekoon, R Bajaj, FC Redeker
US Patent 6,537,144, 2003
892003
Advanced electrolytic polish (AEP) assisted metal wafer planarization method and apparatus
L Sun, S Tsai, F Redeker
US Patent 6,299,741, 2001
892001
Conductive polishing article for electrochemical mechanical polishing
LY Chen, Y Wang, Y Wang, A Duboust, DA Carl, R Wadensweiler, ...
US Patent 7,066,800, 2006
862006
Conductive polishing article for electrochemical mechanical polishing
PD Butterfield, LY Chen, Y Hu, AP Manens, R Mavliev, SD Tsai, FQ Liu, ...
US Patent 6,962,524, 2005
802005
Cu planarization in electrochemical mechanical planarization
FQ Liu, T Du, A Duboust, S Tsai, WY Hsu
Journal of the Electrochemical Society 153 (6), C377, 2006
712006
Method and composition for polishing a substrate
FQ Liu, SD Tsai, Y Hu, SS Neo, Y Wang, A Duboust, LY Chen
US Patent 7,232,514, 2007
682007
Barrier removal at low polish pressure
S Tsai, R Mavliev, L Sun, FQ Liu, LY Chen, R Morad
US Patent 7,104,869, 2006
652006
Method and apparatus for electrochemical-mechanical planarization
L Sun, SD Tsai, FC Redeker
US Patent 6,739,951, 2004
642004
Method and composition for fine copper slurry for low dishing in ECMP
F Liu, S Tsai, Y Hu, LY Chen
US Patent App. 10/845,754, 2004
612004
Method and composition for polishing a substrate
FQ Liu, T Du, A Duboust, Y Wang, Y Hu, SD Tsai, LY Chen, WC Tu, ...
US Patent 7,323,416, 2008
602008
Contacts for electrochemical processing
P Butterfield, LY Chen, Y Hu, A Manens, R Mavliev, S Tsai
US Patent 7,125,477, 2006
582006
Tungsten and cobalt metallization: A material study for MOL local interconnects
V Kamineni, M Raymond, S Siddiqui, F Mont, S Tsai, C Niu, A Labonte, ...
2016 IEEE International Interconnect Technology Conference/Advanced …, 2016
572016
Endpoint monitoring with polishing rate change
S Tsai, FC Redeker, K Wijekoon
US Patent 6,309,276, 2001
562001
Air spacer for 10nm FinFET CMOS and beyond
K Cheng, C Park, C Yeung, S Nguyen, J Zhang, X Miao, M Wang, ...
2016 IEEE International Electron Devices Meeting (IEDM), 17.1. 1-17.1. 4, 2016
532016
Method and composition for polishing a substrate
FQ Liu, LY Chen, SD Tsai, A Duboust, SS Neo, Y Hu, Y Wang, ...
US Patent 7,160,432, 2007
522007
The system can't perform the operation now. Try again later.
Articles 1–20