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Eric PopProfessor of Electrical Engineering & Materials Science, Stanford UniversityVerified email at stanford.edu- David EstradaAssociate Professor of MSE at Boise State; Co-Founder of INFlex LabsVerified email at boisestate.edu
- Feng XiongAssistant Professor, Department of Electrical and Computer Engineering, University of PittsburghVerified email at pitt.edu
- Zhun-Yong OngResearch Scientist, Institute of High Performance Computing, SingaporeVerified email at ihpc.a-star.edu.sg
- Zuanyi LiASMLVerified email at illinois.edu
- Young Duck KimAssociate Professor, Department of Physics, Kyung Hee University, Seoul 02447, Republic of KoreaVerified email at khu.ac.kr
- David G. CahillDepartment of Materials Science and Engineering, University of Illinois at Urbana-ChampaignVerified email at illinois.edu
- Yee Kan KOHNational University of SingaporeVerified email at nus.edu.sg
- Ashkan BehnamDevice Engineer, MicronVerified email at micron.com
- Sharnali IslamUniversity of DhakaVerified email at du.ac.bd
- Jae Cheol ShinAssociate professor in Division of Electronics and Electrical Engineering at Dongguk UniversityVerified email at dongguk.edu
- Albert LiaoEmerging Memory Engineer, MicronVerified email at micron.com
- William P. KingRalph A. Andersen Endowed Chair, Department of Mechanical Science and Engineering, University ofVerified email at illinois.edu
- Rashid BashirDean, Grainger College of Engineering, Grainger Distinguished Chair, Dept of BioengineeringVerified email at illinois.edu
- Enrique CarrionIntelVerified email at intel.com
- Won Il ParkProfessor of Materials Science and Engineering, Hanyang UniversityVerified email at hanyang.ac.kr
- Yonggang HuangWalter P. Murphy Professor of M.E., C.E.E. and M.S.E., Northwestern UniversityVerified email at northwestern.edu
- Shafiqul IslamProfessor, Civil and Environmental Engineering, Water Diplomacy, Tufts UniversityVerified email at tufts.edu
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Myung-Ho Bae
Korea Research Institute of Standards and Science, mhbae@kriss.re.kr
Verified email at kriss.re.kr