| Active and passive integration on flexible glass substrates: Subtractive single micron metal interposers and high performance IGZO thin film transistors R Malay, A Nandur, J Hewlett, R Vaddi, BE White, MD Poliks, SM Garner, ... 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 691-699, 2015 | 10 | 2015 |
| Hermetic metallized via with improved reliability T Huang, M Kanungo, EA Kuksenkova, P Mazumder, CB Moore, ... US Patent 11,152,294, 2021 | 9 | 2021 |
| Bezel-free display tile with edge-wrapped conductors and methods of manufacture J Feng, SM Garner, JC Lin, RG Manley, TJ Orsley, RC Peterson, ... US Patent 11,282,994, 2022 | 7 | 2022 |
| Low thermal conductivity in nanocrystalline Zn3P2 WD Thompson, R Vaddi, BE White Jr Journal of Alloys and Compounds 687, 813-820, 2016 | 6 | 2016 |
| Interposer with manganese oxide adhesion layer PS Brown, Y Gu, M Kanungo, P Mazumder, R Vaddi US Patent App. 16/716,883, 2020 | 5 | 2020 |
| Defect-free metallization of through-glass vias with engineered geometry in additive-free electrolyte S Jayaraman, M Sevem, R Vaddi, M Kanungo, P Mazumder Electrochemistry Communications 120, 106823, 2020 | 4 | 2020 |
| Methods of increasing adhesion between a conductive metal and an oxide substrate and articles made therefrom PS Brown, Y Gu, M Kanungo, P Mazumder, R Vaddi US Patent App. 16/413,777, 2019 | 4 | 2019 |
| Wrap‐around electrodes for microLED tiled displays D Pastel, R Peterson, T Buchholz, H Tadesse, R Vaddi, KT Kuo, S Garner, ... Journal of the Society for Information Display 28 (6), 463-468, 2020 | 3 | 2020 |
| 3d interposer with through glass vias-method of increasing adhesion between copper and glass surfaces and articles therefrom DC Bookbinder, Y Gu, P Mazumder, R Vaddi US Patent App. 16/386,639, 2019 | 3 | 2019 |
| Systems and methods for reducing substrate surface disruption during via formation SM Garner, DW Levesque, RG Manley, GA Piech, R Vaddi, ... US Patent 10,424,606, 2019 | 2 | 2019 |
| Ultralow-Loss Substrate-Integrated Waveguides in Alumina Ribbon Ceramic Substrates for 75–170 GHz Wireless Applications N Aslani-Amoli, M ur Rehman, LNV Kumar, A Moradinia, F Liu, ... IEEE Microwave and Wireless Technology Letters, 2023 | 1 | 2023 |
| First Demonstration of Die-embedded Alumina Ribbon Ceramic (ARC) Packaging for 6G Wireless Applications JW Kim, N Aslani-Amoli, F Liu, R Vaddi, GC Nagar, M Swaminathan 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 1939-1943, 2023 | 1 | 2023 |
| Device including vias and method and material for fabricating vias SM Garner, PS Leslie, BK Nayak, ML Sorensen, R Vaddi US Patent App. 17/286,271, 2021 | 1 | 2021 |
| 23‐2: Distinguished Paper: Wrap‐around Electrodes for MicroLED Tiled Displays D Pastel, R Peterson, T Buchholz, H Tadesse, R Vaddi, KT Kuo, S Garner, ... SID Symposium Digest of Technical Papers 51 (1), 328-331, 2020 | 1 | 2020 |
| 3d interposer with through glass vias-method of increasing adhesion between copper and glass surfaces and articles therefrom H Kim, P Mazumder, A Rezikyan, R Vaddi US Patent App. 16/666,876, 2020 | 1 | 2020 |
| Glass article having a metallic nanofilm and method of increasing adhesion between metal and glass PS Brown, S Jayaraman, P Mazumder, R Vaddi US Patent App. 16/432,472, 2019 | 1 | 2019 |
| Bezel-free display tile with edge-wrapped conductors and methods of manufacture J Feng, SM Garner, JC Lin, RG Manley, TJ Orsley, RC Peterson, ... US Patent 11,777,067, 2023 | | 2023 |
| Method of manufacturing a glass article to provide increased bonding of metal to a glass substrate via the generation of a metal oxide layer, and glass articles such as glass … K Adib, PS Brown, M Kanungo, P Mazumder, R Vaddi US Patent 11,756,847, 2023 | | 2023 |
| Through glass via fabrication using a protective material RG Manley, R Vaddi US Patent 11,654,657, 2023 | | 2023 |
| Systems and Methods for Reducing Via Formation Impact on Electronic Device Formation SM Garner, RG Manley, R Vaddi US Patent App. 17/641,540, 2022 | | 2022 |
