| Dual mode inductively coupled plasma reactor with adjustable phase coil assembly S Banna, VN Todorow, KS Collins, A Nguyen, MJ Salinas, Z Chen, ... US Patent App. 12/821,636, 2011 | 485 | 2011 |
| Fast atomic layer etch process using an electron beam A Agarwal, S Rauf, K Ramaswamy US Patent 9,362,131, 2016 | 241 | 2016 |
| Plasma atomic layer etching using conventional plasma equipment A Agarwal, MJ Kushner Journal of Vacuum Science & Technology A 27 (1), 37-50, 2009 | 204 | 2009 |
| Pulsed high-density plasmas for advanced dry etching processes S Banna, A Agarwal, G Cunge, M Darnon, E Pargon, O Joubert Journal of Vacuum Science & Technology A 30 (4), 2012 | 193 | 2012 |
| Pulsed plasma high aspect ratio dielectric process A Agarwal, KS Collins, S Rauf, K Ramaswamy, TB Lill US Patent 8,382,999, 2013 | 151 | 2013 |
| Synchronized radio frequency pulsing for plasma etching B Liao, K Kawasaki, Y Pattar, SF Shoji, DD Nguyen, K Ramaswamy, ... US Patent 8,962,488, 2015 | 137 | 2015 |
| Effect of cell size and shape on single-cell electroporation A Agarwal, I Zudans, EA Weber, J Olofsson, O Orwar, SG Weber Analytical chemistry 79 (10), 3589-3596, 2007 | 113 | 2007 |
| Inductively coupled pulsed plasmas in the presence of synchronous pulsed substrate bias for robust, reliable, and fine conductor etching S Banna, A Agarwal, K Tokashiki, H Cho, S Rauf, V Todorow, ... IEEE Transactions on Plasma Science 37 (9), 1730-1746, 2009 | 111 | 2009 |
| Synchronized radio frequency pulsing for plasma etching B Liao, K Kawasaki, Y Pattar, SF Shoji, DD Nguyen, K Ramaswamy, ... US Patent 8,404,598, 2013 | 104 | 2013 |
| Apparatus for radial delivery of gas to a chamber and methods of use thereof JA Lee, MJ Salinas, A Agarwal, ER Gold, JP Cruse, A Pal, A Nguyen US Patent 8,562,742, 2013 | 97 | 2013 |
| Effect of simultaneous source and bias pulsing in inductively coupled plasma etching A Agarwal, PJ Stout, S Banna, S Rauf, K Tokashiki, JY Lee, K Collins Journal of Applied Physics 106 (10), 2009 | 67 | 2009 |
| QDB: a new database of plasma chemistries and reactions J Tennyson, S Rahimi, C Hill, L Tse, A Vibhakar, D Akello-Egwel, ... Plasma Sources Science and Technology 26 (5), 055014, 2017 | 64 | 2017 |
| Effect of nonsinusoidal bias waveforms on ion energy distributions and fluorocarbon plasma etch selectivity A Agarwal, MJ Kushner Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 23 (5 …, 2005 | 64 | 2005 |
| Seasoning of plasma etching reactors: Ion energy distributions to walls and real-time and run-to-run control strategies A Agarwal, MJ Kushner Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 26 (3 …, 2008 | 53 | 2008 |
| Efficient AI system design with cross-layer approximate computing S Venkataramani, X Sun, N Wang, CY Chen, J Choi, M Kang, A Agarwal, ... Proceedings of the IEEE 108 (12), 2232-2250, 2020 | 50 | 2020 |
| Numerical calculations of single-cell electroporation with an electrolyte-filled capillary I Zudans, A Agarwal, O Orwar, SG Weber Biophysical journal 92 (10), 3696-3705, 2007 | 43 | 2007 |
| Synchronous pulse plasma operation upon source and bias radio frequencys for inductively coupled plasma for highly reliable gate etching technology K Tokashiki, H Cho, S Banna, JY Lee, K Shin, V Todorow, WS Kim, ... Japanese journal of applied physics 48 (8S1), 08HD01, 2009 | 41 | 2009 |
| Gas heating mechanisms in capacitively coupled plasmas A Agarwal, S Rauf, K Collins Plasma Sources Science and Technology 21 (5), 055012, 2012 | 40 | 2012 |
| Extraction of negative ions from pulsed electronegative capacitively coupled plasmas A Agarwal, S Rauf, K Collins Journal of Applied Physics 112 (3), 2012 | 37 | 2012 |
| Etching with atomic precision by using low electron temperature plasma L Dorf, JC Wang, S Rauf, GA Monroy, Y Zhang, A Agarwal, J Kenney, ... Journal of Physics D: Applied Physics 50 (27), 274003, 2017 | 34 | 2017 |
