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Luca Del Carro, PhD
Luca Del Carro, PhD
II-VI Incorporated
Verified email at ii-vi.com
Title
Cited by
Cited by
Year
Study of non-isothermal liquid evaporation in synthetic micro-pore structures with hybrid lattice Boltzmann model
F Qin, L Del Carro, AM Moqaddam, Q Kang, T Brunschwiler, D Derome, ...
Journal of Fluid Mechanics 866, 33-60, 2019
322019
All-copper flip chip interconnects by pressureless and low temperature nanoparticle sintering
J Zürcher, L Del Carro, G Schlottig, DN Wright, ASB Vardøy, MMV Taklo, ...
2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 343-349, 2016
262016
Review on percolating and neck-based underfills for three-dimensional chip stacks
T Brunschwiler, J Zürcher, L Del Carro, G Schlottig, B Burg, ...
Journal of Electronic Packaging 138 (4), 041009, 2016
172016
Review on percolating and neck-based underfills for three-dimensional chip stacks
T Brunschwiler, J Zürcher, L Del Carro, G Schlottig, B Burg, ...
Journal of Electronic Packaging 138 (4), 041009, 2016
172016
Controlled 3D nanoparticle deposition by drying of colloidal suspension in designed thin micro-porous architectures
F Qin, M Su, J Zhao, AM Moqaddam, L Del Carro, T Brunschwiler, Q Kang, ...
International Journal of Heat and Mass Transfer 158, 120000, 2020
142020
Oxide-free copper pastes for the attachment of large-area power devices
L Del Carro, AA Zinn, P Ruch, F Bouville, AR Studart, T Brunschwiler
Journal of Electronic Materials 48 (10), 6823-6834, 2019
122019
Tricoupled hybrid lattice Boltzmann model for nonisothermal drying of colloidal suspensions in micropore structures
F Qin, AM Moqaddam, L Del Carro, Q Kang, T Brunschwiler, D Derome, ...
Physical Review E 99 (5), 053306, 2019
122019
Low-temperature dip-based all-copper interconnects formed by pressure-assisted sintering of copper nanoparticles
L Del Carro, J Zürcher, U Drechsler, IE Clark, G Ramos, T Brunschwiler
IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (8 …, 2019
92019
Laser sintering of dip-based all-copper interconnects
L Del Carro, M Kossatz, L Schnackenberg, M Fettke, I Clark, ...
2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 279-286, 2018
92018
Morphology of low-temperature all-copper interconnects formed by dip transfer
L Del Carro, J Zürcher, S Gerke, T Wildsmith, G Ramos, T Brunschwiler
2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 961-967, 2017
82017
Direct investigation of microparticle self-assembly to improve the robustness of neck formation in thermal underfills
R Stadler, L Del Carro, J Zürcher, G Schlottig, AR Studart, T Brunschwiler
2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2017
62017
Thermally conductive composite material with percolating microparticles applied as underfill
R Straessle, S Zimmermann, L Del Carro, J Zürcher, G Schlottig, A Achen, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology 8 (5 …, 2017
52017
On the evaporation of colloidal suspensions in confined pillar arrays
J Zürcher, BR Burg, L Del Carro, AR Studart, T Brunschwiler
Transport in Porous Media 125 (2), 173-192, 2018
32018
Relief printing of micron-sized electrical conductive structures on silicon
S Gerke, J Zürcher, L Del Carro, X Chen, T Brunschwiler
Flexible and Printed Electronics 2 (1), 014004, 2017
32017
Chip packages with sintered interconnects formed out of pads
TJ Brunschwiler, L Del Carro, J Zürcher
US Patent 10,777,496, 2020
22020
Anisotropic composite core material for inductor-based fully integrated voltage regulator
S Ye, A Sridhar, L Del Carro, P McCloskey, A Masood, T Brunschwiler
2019 22nd European Microelectronics and Packaging Conference & Exhibition …, 2019
12019
Sintering of copper nanoparticle pastes for microelectronic packaging
L Del Carro
ETH Zurich, 2018
12018
Scalable packaging platform supporting high-performance 3D chip stacks
T Brunschwiler, G Schlottig, A Sridhar, A La Porta, O Ozsun, J Zürcher, ...
2017 Pan Pacific Microelectronics Symposium (Pan Pacific), 1-7, 2017
12017
Personalized copper block for selective solder removal
CL Arvin, L Del Carro, T Brunschwiler, T Weiss, C Muzzy
US Patent 11,235,404, 2022
2022
Integrated circuit (IC) device package lid attach utilizing nano particle metallic paste
CL Arvin, K Drummond, L Del Carro, T Brunschwiler, S Allard, KC Marston, ...
US Patent 11,164,804, 2021
2021
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